| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a sticking apparatus which can suppress that a protection sheet to be stuck protrudes from a semiconductor wafer.SOLUTION: A sticking apparatus 1 includes a table 80 on which a semiconductor wafer W of a circle form is loaded, a band-like material support mechanism 10 for supporting band-like material M in which a film for protection sheet formation is stuck on one side surface of a base sheet, a band-like material conveying mechanism for conveying the band-like material M, and a cutting roller 21 on which a sheet-like blade is wound and mounted, and comprises a precut mechanism 20 which makes a cutting of a closed loop on the film to form a protection sheet, and a sticking mechanism 50 which peels the protection sheet from the base sheet and sticks it to the semiconductor wafer W. The sheet-like blade is constituted by protruding from the sheet an elliptic blade of the major and the minor axes shorter than the diameter of the semiconductor wafer W, to form an elliptic protection sheet.</p> |
