| 摘要 |
PURPOSE: A washing agent for a semiconductor device is provided to remove organic materials and particles present on the surface of a semiconductor device with copper wiring. CONSTITUTION: A washing agent for a semiconductor device is used after chemical mechanical polishing of the semiconductor device with copper wiring. The washing agent for a semiconductor device comprises a polycarboxylic acid compound, a chelating agent and an anionic surfactant. The polycarboxylic acid compound is represented by formula (1), wherein R1 shows a single bond or alkylene group; R2 and R3 independently show a hydrogen atom or organic group, or form a ring structure with a carbon atom adjacent to R2 and R3 through bond of R2 and R3. |
