PLASTIC FILMS FOR TRANSPARENT FLEXIBLE SUBSTRATES

摘要

The present invention relates to a plastic film for a transparent flexible substrate which mixes a bisphenol-A type epoxy resin with a phenoxy resin and uses an imidazole-based curing agent which is a basic curing agent mixed with an isocyanate-based curin agent, to maintain curing properties regardless of the tickness of the film, to be transparent while having an effect of excellent heat resistance and flexibility, in order to improve the thermal stability of the plastic film made of a phenoxy resin. The plastic film for transparent flexible substrates according to the present invention for achieving the same is characterized by comprising a bisphenol-A type epoxy resin, a phenoxy resin, and a curing agent, while the plastic film is characterized by being manufactured to have the thickness of 10-500 micrometers.