发明名称 LED CHIPS ON DEVICES AND ADVANCED METHODS OF MANUFACTURING THEM
摘要 <p>A LED lighting system, where multiple LED semiconductor chips are sandwiched in a thermally insulating and light- transmissive solid body at the bottom and at the top and are, therefore, heat-insulated from the outer surfaces with a thermal resistance of less than 3 W/mK.</p>
申请公布号 WO2014111247(A1) 申请公布日期 2014.07.24
申请号 WO2014EP00063 申请日期 2014.01.14
申请人 MUESSLI, DANIEL 发明人 MUESSLI, DANIEL
分类号 F21K99/00;H01L33/50;H01L33/64 主分类号 F21K99/00
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