| 摘要 |
PROBLEM TO BE SOLVED: To improve quality of an electronic component manufactured by flip-chip mounting.SOLUTION: In a circuit board, the surface of a mounting region where a prescribed chip is mounted is made flat and exposed. In a connection position of each terminal of the chip on a pattern formed in the mounting region, solder bumps having substantially the same shape are formed, respectively. This technique can be applied to, for example, the circuit board of an electronic component manufactured by flip-chip mounting. |
