MOISTURE BARRIER LAYER DIELECTRIC FOR THERMOFORMABLE CIRCUITS

摘要

PROBLEM TO BE SOLVED: To provide a moisture barrier layer dielectric for thermoformable circuits.SOLUTION: This invention is directed to a polymer thick film moisture barrier layer dielectric composition comprising thermoplastic urethane resin, thermoplastic phenoxy resin, diacetone alcohol and fumed silica. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver above it and the polycarbonate substrate below it in capacitive switch applications.