| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which can achieve improvement in connection reliability without increase in area of a connection part with an electrode pad by devising shapes of openings of a through electrode.SOLUTION: A semiconductor device 10 including a through electrode 13 formed from one surface toward the other surface of an Si substrate 12 comprises: a rectangular electrode pad 24 provided on the other surface 16 via an insulation film 20; and a through hole 21 which composes the through electrode 13 and has an opening on the other surface 16 side formed narrower than an opening on the one surface 14 side, in which the opening on the other surface 16 side has a rectangular shape and is arranged in an inner region of the electrode pad 24, and the electrode pad 24 and the through electrode 13 are connected. In the semiconductor device 10 having such characteristics, it is preferable that an opening of the through hole 21 on the one surface 14 side is circular.</p> |
