发明名称 SURFACE-TREATED COPPER FILM, LAMINATE SHEET, PRINTED WIRING BOARD AND PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a surface-treated copper film, a laminate sheet, a printed wiring board and a printed circuit board having good suppressed transmission loss even when used in a high frequency circuit base board.SOLUTION: There is provided a surface-treated copper film having a surface-treated layer and being in an area surrounded by 4 linear lines of x=0, y=0, y=-0.000189x+1.400000 and y=-0.002333x+9.333333 in the coating weight-surface roughness graph drawn with x axis as the total coating weight (μg/dm) of Co, Ni, Fe and Mo in the surface-treated layer and y axis as the surface roughness of the surface-treated layer Rz(μm).
申请公布号 JP2014133936(A) 申请公布日期 2014.07.24
申请号 JP20130003859 申请日期 2013.01.11
申请人 JX NIPPON MINING & METALS CORP 发明人 ARAI EITA ; FUKUCHI RYO
分类号 C25D7/06;H05K1/09 主分类号 C25D7/06
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