FAN-OUT PACKAGE STRUCTURE AND METHODS FOR FORMING THE SAME

摘要

A package includes a device die including a first plurality of metal pillars at a top surface of the device die. The package further includes a die stack including a plurality of dies bonded together, and a second plurality of metal pillars at a top surface of the die stack. A polymer region includes first portions encircling the device die and the die stack, wherein a bottom surface of the polymer region is substantially level with a bottom surface of the device die and a bottom surface of the die stack. A top surface of the polymer region is level with top ends of the first plurality of metal pillars and top ends of the second plurality of metal pillars. Redistribution lines are formed over and electrically coupled to the first and the second plurality of metal pillars.

主权项

1. A package comprising:
a device die comprising a first plurality of metal pillars at a top surface of the device die; a die stack comprising:
a plurality of dies bonded together; anda second plurality of metal pillars at a top surface of the die stack; a polymer region comprising first portions encircling the device die and the die stack, wherein a bottom surface of the polymer region is substantially level with a bottom surface of the device die and a bottom surface of the die stack, and wherein a top surface of the polymer region is level with top ends of the first plurality of metal pillars and top ends of the second plurality of metal pillars; and redistribution lines over and electrically coupled to the first and the second plurality of metal pillars.