| 摘要 |
A light emitting module according to an embodiment in order to prevent insufficient soldering and cold soldering may include a base; a light emitting device package disposed on the base; an electrode pattern disposed on the base and supplying power by being electrically connected to the light emitting package; a plurality of first patterns disposed at the side of the electrode pattern; solder disposed on the electrode pattern; and a second pattern disposed between the adjacent first patterns and disposed to be in contact with the solder. |
