| 摘要 |
Reflow soldering apparatus (10) comprising a vapour chamber (12) in communication with a reservoir (16) of heat transfer fluid (18) such that a volume of vaporised heat transfer fluid (18) is created and held in the vapour chamber (12) by heating of the heat transfer fluid (18). A heating chamber (14) is provided for receiving a board (24) and a transportation mechanism is provided to transport vapour, and/or condensate formed from the vapour, from the volume of vaporised heat transfer fluid (18) to the heating chamber (14). The transported vapour and/or condensate applies heat to the heating chamber (14) for the reflow soldering process. |
