Methods and Apparatus of Packaging of Semiconductor Devices

摘要

Methods and apparatuses for forming an under-bump metallization (UBM) pad above a dielectric layer are disclosed. The dielectric layer may be above a metal layer and comprises a first opening and a second opening surrounding the first opening, which divide the dielectric layer into a first area and a second area. An UBM pad extends into and fills the first opening of the dielectric layer, above the first area between the first opening and the second opening, and may further extends down at least partly into the second opening covering a part or the whole of the second opening of the dielectric layer. The UBM pad may further extend over a part of the second area of the dielectric layer if the UBM pad fills the whole of the second opening of the dielectric layer. A solder ball may be mounted on the UBM pad.

主权项

1. A device, comprising:
a substrate; a metal layer on the substrate; a passivation layer above the metal layer with an opening exposing the metal layer; a dielectric layer above the passivation layer and the metal layer, wherein the dielectric layer comprises a first opening exposing the metal layer, a second opening surrounding the first opening, a first area between the first opening and the second opening, and a second area outside the second opening; and an under-bump metallization (UBM) pad extending down within and filling the first opening of the dielectric layer in contact with the metal layer, extending above the first area of the dielectric layer, and extending down filling at least a part of the second opening of the dielectric layer.