CHIP PACKAGE AND METHOD FOR FORMING THE SAME

摘要

A chip package includes: a substrate; a signal pad and a ground pad disposed on the substrate; a first and a second conducting layers disposed on the substrate and electrically connected to the signal pad and the ground pad, respectively, wherein the first and the second conducting layers extend from an upper surface of the substrate towards a lower surface of the substrate along a first and a second side surfaces of the substrate, respectively, and the first and the second conducting layers protrude from the lower surface; and a protection layer disposed on the substrate, wherein the protection layer completely covers the entire portion of the first conducting layer located on the first side surface of the substrate, and the entire portion of the second conducting layer located on the second side surface of the substrate is not covered by the protection layer.

主权项

1. A chip package, comprising:
a substrate; a first conducting layer over the substrate, wherein the first conducting layer extends from an upper surface of the substrate towards a lower surface of the substrate along a first side surface of the substrate, and the first conducting layer protrudes from the lower surface; a second conducting layer over the substrate, wherein the second conducting layer extends from the upper surface of the substrate towards the lower surface of the substrate along a second side surface of the substrate, and the second conducting layer protrudes from the lower surface; and a protection layer over the substrate, wherein the protection layer completely covers the entire portion of the first conducting layer over the first side surface of the substrate, and the entire portion of the second conducting layer over the second side surface of the substrate is substantially not covered by the protection layer.