| 发明名称 |
CHIP PACKAGE COMPRISING A MICROPHONE STRUCTURE AND A METHOD OF MANUFACTURING THE SAME |
| 摘要 |
In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially free from the encapsulation material. |
| 申请公布号 |
US2014203380(A1) |
申请公布日期 |
2014.07.24 |
| 申请号 |
US201313747499 |
申请日期 |
2013.01.23 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
Theuss Horst |
| 分类号 |
B81C1/00;B81B3/00 |
主分类号 |
B81C1/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a chip package, the method comprising:
arranging a chip over a substrate, the chip comprising a microphone structure and an opening to the microphone structure; forming a spacer structure around the microphone structure; and encapsulating the chip with encapsulation material; wherein the spacer structure is configured to keep the opening at least partially free from the encapsulation material. |
| 地址 |
Neubiberg DE |
