主权项 |
1. A method of fabricating a component, comprising:
providing a substrate having a first surface and a second surface remote therefrom, the substrate having a CTE less than 10 ppm/° C., the substrate having an opening extending from the first surface towards the second surface; depositing a plurality of base particles into the opening, each base particle including a first metal region and a second metal layer covering the first metal region, the second metal layer having a melting point below 400° C., the first metal region having a melting point of 500° C. or more; and heating the base particles so that each second metal layer fuses the base particles to one another to form a continuous conductive via extending within the opening, the conductive via including voids interspersed between the joined base particles, the voids occupying 10% or more of a volume of the conductive via. |