| 摘要 |
Provided is an active matrix substrate (2), wherein a plurality of signal wires (17) are disposed, said signal wires (17) comprising first and second wiring parts (17a, 17b), and inner-side connection parts (connection parts) (17c) which connect the first and second wiring parts (17a, 17b). The first and second wiring parts (17a, 17b) of one of two adjacent signal wires (17) are respectively configured of first and second conductive layers, and the first and second wiring parts (17a, 17b) of the other of the two adjacent signal wires (17) are respectively configured of the second and the first conductive layers. With each of the plurality of signal wires (17), the location of the connection part (17c) of the signal wire (17) is established according to the wiring location in the wiring region of the signal wire (17). |
