FLIP-CHIP WAFER LEVEL PACKAGE AND METHODS THEREOF

摘要

An electronic package includes a flip-chip component having a first die coupled to a flip-chip substrate, second die stacked on the first die, an encapsulation compound formed around the first die and the second die, a set of through encapsulant vias (TEVs) providing a set of electrical connections from a first side of the electronic package to a second side of the electronic package through the encapsulation compound to the flip-chip substrate, and a redistribution layer electrically connecting a set of contacts on the second die to the set of TEVs on the first side of the electronic package.

主权项

1. A method for manufacturing an electronic package, the method comprising:
providing a flip-chip component having a first die coupled to a flip-chip substrate; adhering the first die to a second die; forming an encapsulation compound around the first die and the second die; drilling a set of through encapsulant vias (TEVs) from a first side of the electronic package to the flip-chip substrate located on a second side of the electronic package; filling the set of TEVs with an electrically conductive material; and applying a redistribution layer electrically connecting a set of contacts on the second die to the set of TEVs on the first side of the electronic package.