METHOD OF INSPECTING WAFER

摘要

Wafer inspection method to perform wafer inspection based on photo map information. The wafer inspection method may include: detecting a sample center location on a wafer; compensating the detected sample center location to a compensated center location based on photo map information; and detecting defective dies included in the wafer based on the compensated center location.

主权项

1. A wafer inspection system comprising a wafer inspection device that comprises:
an inspection unit that detects a sample center location on a wafer, and inspects the wafer with respect to a compensated center location according to an inspection control signal, and generates defect data; and an inspection control unit that generates the inspection control signal, wherein the inspection control signal compensates the sample center location to the compensated center location according to photo map information.