ADHESIVE SHEET, DICING TAPE INTEGRATED ADHESIVE SHEET, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive sheet capable of preventing a circuit on a semiconductor chip from being destructed in a manufacturing process of a semiconductor device.SOLUTION: In a dicing tape integrated adhesive sheet 1 which is used for manufacture of a semiconductor device in order to prevent a semiconductor element from being destructed by peeling electrification at the time of pickup, the adhesive sheet 1 is used in which a polymer type antistatic agent is contained. As a result, after being peeled off from the dicing tape, decline in an antistatic function can be suppressed and improvement in reliability as a device is made possible.