发明名称 SOLDERING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a soldering method capable of achieving excellent soldering between a pad and a conductive wire.SOLUTION: Disclosed is a soldering method in which, after attaching an amount of solder 11 satisfying the formula (1) below to a pad 3 in advance, a conductive wire 21 is soldered to the pad 3 by melting solder 12. However, in the formula (1), A is a diameter of the conductive wire 21, B is a length of the conductive wire 21 in the extension direction on the pad 3, C is a length of the pad 3 along the extension direction of the conductive wire 21, D is a width of the pad 3, X is an amount of solder 13, andπis a circle ratio.</p>
申请公布号 JP2014135206(A) 申请公布日期 2014.07.24
申请号 JP20130002776 申请日期 2013.01.10
申请人 FUJIKURA LTD 发明人 TERASHI DAISUKE;KOJIMA SHIGERU
分类号 H01R43/02;H01R12/57;H05K3/34 主分类号 H01R43/02
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