Integrated Circuits with Magnetic Core Inductors and Methods of Fabrications Thereof

摘要

In one embodiment, a method of forming a semiconductor device includes forming a first inductor coil within and/or over a substrate. The first inductor coil is formed adjacent a top side of the substrate. First trenches are formed within the substrate adjacent the first inductor coil. The first trenches are filled at least partially with a magnetic fill material. At least a first portion of the substrate underlying the first inductor coil is thinned. A backside magnetic layer is formed under the first portion of the substrate. The backside magnetic layer and the magnetic fill material form at least a part of a magnetic core region of the first inductor coil.

主权项

1. A semiconductor device comprising:
a first inductor coil within and/or over a substrate, the first inductor coil formed adjacent a top side of the substrate; first trenches disposed within the substrate adjacent the first inductor coil, wherein the first trenches are filled at least partially with a magnetic fill material; and a backside magnetic layer disposed under a first portion of the substrate at a bottom side, wherein the backside magnetic layer and the magnetic fill material form at least a part of a magnetic core region of the first inductor coil, wherein the backside magnetic layer comprises a structured layer disposed under the first inductor coil, wherein, at the bottom side, a second portion of the substrate is not covered by the backside magnetic layer.