发明名称 MULTILAYER SUBSTRATE MODULE
摘要 A multilayer substrate module includes a multilayer circuit substrate, a mounting land, and an input/output terminal. Inside the multilayer circuit substrate, a wiring line that connects the mounting land and the input/output terminal to each other, an inductor that defines a portion of the wiring line, a first ground conductor that is positioned on the one main surface side of the inductor, and a second ground conductor that is positioned on the other main surface side of the inductor are defined by conductor patterns. The area where inductor is located is not superposed with the area where the second ground conductor is located, when the one main surface or the other main surface of the multilayer circuit substrate is viewed in plan, the second ground conductor being closer to the layer where the inductor is located than the first ground conductor is.
申请公布号 US2014202750(A1) 申请公布日期 2014.07.24
申请号 US201414148979 申请日期 2014.01.07
申请人 Murata Manufacturing Co., Ltd. 发明人 KOGURE Takeshi;KITAJIMA Hiromichi
分类号 H05K1/02;H05K1/18 主分类号 H05K1/02
代理机构 代理人
主权项 1. (canceled)
地址 Nagaokakyo-shi JP