发明名称 CURABLE RESIN COMPOSITION, CURED FILM, AND METHOD FOR PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition which can be cured by low-temperature and short-time heating or by light exposure of an appropriate energy mount, and which can provide, without interfering functions of liquid crystal displays and the like, a cured film excellent in surface smoothness; heat resistance; adhesiveness to ground substrates such as glass, an organic material, and the like; transparency; scratch resistance; and, especially, chemical resistances such as solvent resistance, acid resistance, alkali resistance, and the like; and to provide a cured film obtained therefrom and a method for producing the cured film.SOLUTION: The provided curable resin composition includes: a polyester-amic acid obtained by a reaction of compounds including a tetracarboxylic dianhydride, a diamine, and a polyhydric hydroxy compound; an epoxy resin; and a cationic curative which generates a cationic species by an action of heat and/or light. Also provides is a method for producing a cured film obtained by curing the same.
申请公布号 JP2014133821(A) 申请公布日期 2014.07.24
申请号 JP20130002684 申请日期 2013.01.10
申请人 JNC CORP 发明人 KOBAYASHI YOSHITAKA;MEGURO SATOSHI
分类号 C08G59/46;C08G73/16;G02F1/1333;G02F1/1335 主分类号 C08G59/46
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