CUTTING DEVICE, CUTTING METHOD, AND PROGRAM

摘要

PROBLEM TO BE SOLVED: To provide a cutting device capable of cutting a semiconductor package without cutting a printed circuit board.SOLUTION: A cutting device 100 is a device for cutting and removing a semiconductor package from a printed circuit board. The cutting device 100 includes: a height information acquisition unit that acquires information on height of a corner at the highest position among four corners of an upper surface of a semiconductor package 210; a depth information acquisition unit that acquires information on a cutting depth; and a cutting control unit that cuts the semiconductor package 210 in parallel to an installation surface of an installation table 110. The cutting control unit cuts the semiconductor package 210 from the height acquired by the height information acquisition unit to the depth acquired by the depth information acquisition unit.