发明名称 RANDOM CODED INTEGRATED CIRCUIT STRUCTURES AND METHODS OF MAKING RANDOM CODED INTEGRATED CIRCUIT STRUCTURES
摘要 Randomized coded arrays and methods of forming a randomized coded array. The methods include: forming a dielectric layer on a semiconductor substrate; forming an array of openings extending through the dielectric layer; introducing particles into a random set of less than all of the openings; and forming a conductive material in each opening of the array of openings, thereby creating the randomized coded array, wherein a first resistance of a pathway through the conductive material in openings containing the particles is different from a second resistance of a path through openings not containing the particles. Also, a physically unclonable function embodied in a circuit.
申请公布号 US2014203448(A1) 申请公布日期 2014.07.24
申请号 US201313746427 申请日期 2013.01.22
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 Song Yunsheng;Wong Keith Kwong Hon;Xin Yongchun;Yang Zhijian
分类号 H01L21/02;H01L23/538 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method of forming a randomized coded array, comprising: forming a dielectric layer on a semiconductor substrate; forming an array of openings extending through said dielectric layer; introducing particles into a random set of less than all of said openings; and forming a conductive material in each opening of said array of openings, thereby creating said randomized coded array, wherein a first resistance of a pathway through said conductive material in openings containing said particles is different from a second resistance of a path through openings not containing said particles.
地址 Armonk NY US
您可能感兴趣的专利