| 发明名称 |
PRINTED CIRCUIT BOARD HAVING METAL BUMPS |
| 摘要 |
A printed circuit board includes an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; and a metal bump formed on the circuit pattern and the insulating layer |
| 申请公布号 |
US2014202748(A1) |
申请公布日期 |
2014.07.24 |
| 申请号 |
US201414226584 |
申请日期 |
2014.03.26 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KANG Myung Sam;PARK Jeong Woo;KIM Ok Tae;YUN Kil Yong |
| 分类号 |
H05K1/11;H05K1/09 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; and a metal bump formed on the circuit pattern and the insulating layer. |
| 地址 |
Suwon KR |
