PLATING APPARATUS AND PLATING METHOD

摘要

The present invention relates to a plating apparatus and a plating method. The plating apparatus includes a to-be-plated material transferring part which transfers a material to be plated including a pattern to be plated, and cathode rollers. At least an outer surface of the cathode roller has electric conductivity. The cathode roller includes a rotary shaft extended in one direction. The extending direction of the rotary shaft and the transfer direction of the material to be plated cross each other at an angle of inclination.