发明名称 HEAT DISSIPATING DEVICE AND PACKAGE FOR HEAT DISSIPATING USING THE SAME
摘要 Provided are a heat dissipation support plate and a heat dissipation package. A heat dissipation support plate includes a base part for supporting a heat source, a heat dissipation part which includes a porous fine structure part which is formed in the base part and transfers the heat of the heat source, and a phase change material which fills at least parts of the void of the porous fine structure, and a connection part which is formed in the base part for electrical wiring with the heat source. Therefore, a heat dissipation element, which comprises an open cell type porous fine structure part and the phase change material, provides a heat dissipation characteristic which prevents the overheat of the heat source by a high heat absorption capacity due to a phase change phenomenon.
申请公布号 KR20140092543(A) 申请公布日期 2014.07.24
申请号 KR20130004679 申请日期 2013.01.16
申请人 LG ELECTRONICS INC. 发明人 YEE, YOUNG JOO
分类号 H01L23/34;H05K7/20 主分类号 H01L23/34
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