ADHESIVE SHEET, DICING TAPE INTEGRATED ADHESIVE SHEET, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive sheet that can prevent breakdown of a circuit on a semiconductor chip in a production process of a semiconductor device.SOLUTION: In order to prevent breakdown of a semiconductor element caused by peeling electrification during pickup, a dicing tape integrated adhesive sheet 1 used in the production of a semiconductor device has a multilayered structure. In the adhesive sheet 1, the surface of any one outermost layer containing an antistatic agent has a surface specific resistance of 1.0×10&OHgr; or less.