发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING DEVICE AND PROGRAM
摘要 PROBLEM TO BE SOLVED: To form a nitride film or an oxynitride film which has a low hydrogen concentration, good uniformity in film thickness and good step coverage.SOLUTION: A semiconductor device manufacturing method comprises: a process of forming, on a substrate, a film which contains at least one element selected from a group consisting of nitrogen, carbon and boron, a predetermined element and oxygen by performing a cycle predetermined times, the cycle including: a process of supplying, to the substrate, a material gas which contains the predetermined element, chlorine and oxygen and has chemical bonds between the predetermined element and oxygen; and a process of supplying, to the substrate, a reaction gas which contains at least one element selected from a group consisting of nitrogen, carbon and boron.
申请公布号 JP2014135475(A) 申请公布日期 2014.07.24
申请号 JP20130229896 申请日期 2013.11.06
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 HARADA KATSUYOSHI;HIROSE YOSHIRO;SANO ATSUSHI
分类号 H01L21/318;C23C16/42;C23C16/455;H01L21/31;H01L21/316;H01L21/336;H01L21/768;H01L21/8247;H01L23/532;H01L27/115;H01L29/78;H01L29/788;H01L29/792 主分类号 H01L21/318
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