| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device.SOLUTION: When a multiple base substrate 17 and a multiple sub substrate 18 are bonded together, the multiple base substrate 17 with an upper surface 17a on which a semiconductor chip 2 and a plurality of conductive members 8 are mounted is opposed to the multiple sub substrate 18 with a lower surface 18b to which a film-like sealing body 10 thicker than the mounting height of the chip is bonded in advance, and heat and load are applied for bonding the substrates through the plurality of conductive members 8. Accordingly, voids included in the sealing body 10 at the time of bonding are reduced and the reliability of the semiconductor device can be improved.</p> |
