| 发明名称 |
METHODS AND APPARATUS FOR CONDITIONING OF CHEMICAL MECHANICAL POLISHING PADS |
| 摘要 |
A method and apparatus for conditioning a polishing pad is provided. In one embodiment, a pad conditioning device for a substrate polishing process is provided. The pad conditioning device includes an optical device coupled to a portion of a polishing station adjacent a polishing pad, the optical device comprising a laser emitter adapted to emit a beam toward a polishing surface of the polishing pad, the beam having a wavelength range that is substantially non-reactive with a polishing fluid utilized in the polishing process, but is reactive with the polishing pad. |
| 申请公布号 |
US2014206263(A1) |
申请公布日期 |
2014.07.24 |
| 申请号 |
US201313801127 |
申请日期 |
2013.03.13 |
| 申请人 |
BAJAJ Rajeev;CHEN Hung Chih |
发明人 |
BAJAJ Rajeev;CHEN Hung Chih |
| 分类号 |
B24B53/017;B24B53/00;B24B37/34 |
主分类号 |
B24B53/017 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A pad conditioning device for a substrate polishing process, the pad conditioning device comprising:
an optical device coupled to a portion of a polishing station adjacent a polishing pad, the optical device comprising a laser emitter adapted to emit a beam toward a polishing surface of the polishing pad, the beam having a wavelength range that is substantially non-reactive with a polishing fluid utilized in the polishing process, but is reactive with the polishing pad. |
| 地址 |
Fremont CA US |
