MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS

摘要

An interconnect structure for electrically joining two surfaces includes magnetic attachment structures and an anisotropic conductive adhesive (ACA). Magnetic attachment structures on a first surface are magnetically attracted to magnetic attachment structures on a second surface. Opposing magnetic attachment structures are joined via an ACA, which conducts electricity when compressed, and is electrically insulating when not compressed. The magnetic attraction between opposing magnetic attachment structures generates a sufficient force to maintain compression of the intervening ACA in order to sustain a desired level of electrical conductivity between the first surface and second surface. A method for joining two surfaces using the interconnect structure is disclosed. Additionally, a magnetic anisotropic conductive adhesive having magnetic conductive particles dispersed therein is disclosed.

主权项

1. A structure, comprising:
a first magnetic attachment structure disposed on a first surface; a second magnetic attachment structure disposed on a second surface, wherein the second magnetic attachment structure is magnetically attracted to the first magnetic attachment structure; and an anisotropic conductive adhesive electrically coupling the first magnetic attachment structure and second magnetic attachment structure.