发明名称 LED CHIP AND MANUFACTURING METHOD THEREOF
摘要 <p>Provided are an LED chip and a manufacturing method thereof. The method for manufacturing the LED chip comprises: forming an epitaxial layer (102) on one side of a sapphire substrate (101); forming prismoids (201) disposed in an array on the other side of the sapphire substrate; and forming a reflecting layer (105) on the side where the prismoids are formed, of the sapphire substrate. In this manner, an emergence angle of light on the surface of the LED chip is changed by means of secondary reflection on the reflecting layer; the reflecting layer and the light-emitting surface of the LED cannot form a waveguide structure; and the probability of total reflection is reduced, thereby achieving the objective of improving the light precipitation rate.</p>
申请公布号 WO2014110975(A1) 申请公布日期 2014.07.24
申请号 WO2013CN91059 申请日期 2013.12.31
申请人 ENRAYTEK OPTOELECTRONICS CO., LTD. 发明人 WANG, YANG
分类号 H01L33/00 主分类号 H01L33/00
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