| 发明名称 |
INTERCONNECTION DESIGNS AND MATERIALS HAVING IMPROVED STRENGTH AND FATIGUE LIFE |
| 摘要 |
Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter. |
| 申请公布号 |
US2014203430(A1) |
申请公布日期 |
2014.07.24 |
| 申请号 |
US201414171458 |
申请日期 |
2014.02.03 |
| 申请人 |
Micron Technology, Inc. |
发明人 |
Sterrett Terry Lee;Harries Richard J. |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system comprising:
an integrated circuit die; an integrated circuit package; a first level interconnection between the die and the package; a system board; a second level interconnection between the package and the system board; and interconnect bumps in at least one of the interconnections, the interconnect bumps including a diameter greater than a height of interconnect bumps. |
| 地址 |
Boise ID US |
