| 摘要 |
PROBLEM TO BE SOLVED: To prevent cracks from being easily generated in a case where the exposed part of a semiconductor chip is reduced.SOLUTION: By the pressure for injecting a resin MR into a second space, a gap is generated at a contact part SEL where an elastic film LAF and a semiconductor chip CHP1 come into contact with each other; and a resin MR2 of a component different from the resin MR soaks into this gap. As a result, the resin MR2 is formed in an area, excluding a flow detecting unit FDU and its adjacent area, out of the area of the semiconductor chip CHP1 that is exposed from the resin MR. Thus, the area of the semiconductor chip CHP1 that is exposed from the resin MR and resin MR2 can be reduced. |
