| 发明名称 |
LIGHT EMITTING DEVICE PACKAGE |
| 摘要 |
A light emitting device package includes a substrate, a light emitting device disposed on the substrate, a reflector surrounding the light emitting device, and an encapsulant encapsulating the light emitting device. The reflector includes a silicon-based polymer which is a main body portion, and a silicon oxide layer disposed at least on a portion of a surface of the silicon-based polymer. |
| 申请公布号 |
US2014203728(A1) |
申请公布日期 |
2014.07.24 |
| 申请号 |
US201314135078 |
申请日期 |
2013.12.19 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YANG Hyun-kwan;KIM Jin-mo;LEE Kyu-jin;AN Hyung-jin |
| 分类号 |
H01L33/60;H05B33/08 |
主分类号 |
H01L33/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting device package, comprising:
a substrate; a light emitting device disposed on the substrate; a reflector surrounding the light emitting device; and an encapsulant encapsulating the light emitting device, wherein the reflector comprises: a silicon-based polymer which is a main body portion; and a silicon oxide layer disposed at least on a portion of a surface of the silicon-based polymer. |
| 地址 |
Suwon-si KR |
