ACTIVE CHIP ON CARRIER OR LAMINATED CHIP HAVING MICROELECTRONIC ELEMENT EMBEDDED THEREIN

摘要

A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connect the additional microelectronic element to the active elements of the first chip. The structure may have a volume comparable to that of the first chip alone and yet provide the functionality of a multi-chip assembly. A composite chip incorporating a body and a layer of semiconductor material mounted on a front surface of the body similarly may have a cavity extending into the body from the rear surface and may have an additional microelectronic element mounted in such cavity.

主权项

1. A microelectronic structure comprising:
(a) a first semiconductor chip having a body with oppositely-facing front and rear surfaces, first contacts exposed at the front surface, a cavity extending into the body from the rear surface, the cavity having a rearwardly-facing cavity floor surface, the first semiconductor chip having first via conductors extending into the first chip from the cavity floor surface, and (b) an additional microelectronic element disposed within the cavity, the additional microelectronic element having a top surface facing toward the cavity floor surface of the first chip, active circuit elements disposed in an active layer near the top surface, and a bottom surface facing in the same direction as the rear surface of the first chip, the additional microelectronic element having top contacts exposed at the top surface and electrically connected to at least some of the first via conductors, the additional microelectronic element having bottom contacts exposed at the bottom surface.