3 DIMENTIONAL WIRELESS CHIP PACKAGE

摘要

The present invention relates to a three dimensional wireless chip package. A three dimensional wireless chip package according to an embodiment of the present invention includes a substrate which has a power voltage pad for receiving power voltage, a first wireless chip which is connected to the power voltage pad to receives power voltage and transmits AC power, one or more second wireless chips which are formed in the upper or the lower surface of the first wireless chip and receives the AC power from the first wireless chip. Therefore, the use number of bonding wires can be reduced by the wireless power communications between chips, thereby facilitating the lamination of the chips in an IC designing process.