| 摘要 |
PROBLEM TO BE SOLVED: To suppress warpage of a BGA package, and thereby enhancing reflow resistance and handleability of a composition powder for an epoxy resin composition for compression molding.SOLUTION: A blending ratio of an inorganic filler is 88 mass% or more based on the whole composition, a ratio of triphenylmethane-based phenol in a curing agent is 70 mass% or more and a particle size distribution of powder in the composition is 2 mass% or less with 2.4 mm or more and 5 mass% or less with 0.2 mm or less. |
