| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed board equipped with an interlayer connection hole which is required for improvement in the component mounting density of a multilayer substrate and high speed operation and prevents leakage of an unnecessary signal between signals.SOLUTION: On the inner wall of an interlayer connection hole of a printed board which transmits high speed signals, an electrode connected to a signal line and an electrode connected to ground are alternately arranged while keeping them insulated from each other, and a plurality of interlayer connection holes are arranged so that the electrode connected to the signal line and the electrode connected to the ground in neighboring interlayer connection holes are adjacent to each other. |
