| 发明名称 |
CIRCUIT BOARD MATERIAL |
| 摘要 |
A circuit board material includes an electrical resistance material layer having a preselected resistivity adhered to the support layer, and a barrier layer adhered to the electrical resistive layer, and a conductive layer adhered to the barrier layer, wherein the barrier layer is plated on the conductive material such that the resistance of the subsequently applied resistive layer does not vary substantially during exposure to printed circuit board processing chemistries. The process for making the material is directed to adjusting the electro deposition of the barrier layer by using the time for etching the resistive layer of the circuit board material in a standard etching bath. |
| 申请公布号 |
US2014205854(A1) |
申请公布日期 |
2014.07.24 |
| 申请号 |
US201414158069 |
申请日期 |
2014.01.17 |
| 申请人 |
Ohmega Technologies, Inc. |
发明人 |
BRANDLER Daniel;MAHLER Bruce |
| 分类号 |
H05K1/03;H05K3/06 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit board material comprising an electrical resistance material layer having a preselected resistivity adhered to the support layer, a barrier layer adhered to the electrical resistive layer, and a conductive layer adhered to the barrier layer, wherein the barrier layer is plated on the conductive material such that the resistance of the subsequently applied resistive layer does not vary substantially during exposure to printed circuit board processing chemistries. |
| 地址 |
Culver City CA US |
