Cooling module for laser, fabricating method thereof, and semiconductor laser fabricated from the module

摘要

A cooling module for fabricating a liquid-cooled semiconductor laser, a fabricating method, and a semiconductor laser fabricated from the module are provided, wherein the cooling module for a laser makes use of a liquid cooling plate provided with radiating fins to cool the semiconductor chip. After replacement of the traditional micro-channel structure with the radiating fin structure, the cooling module effectively reduces the resistance to flow of the cooling liquid, remarkably lowers the pressure decrease of the cooling liquid, makes it easier to seal the cooling liquid, provides stronger heat dissipating capability, effectively prolongs the lifetime of the semiconductor laser, and enhances the output power and reliability of the semiconductor laser, alongside the advantages of simple fabrication and low production cost.

主权项

1. A method for fabricating a cooling module for a laser, wherein the method comprises following steps of:
(1) firstly processing a liquid cooling plate into a rectangular plate, surface-polishing the liquid cooling plate, and providing a fixing hole and a liquid outlet thereon; (2) processing a liquid inlet and a radiating fin on the liquid cooling plate, and reserving for a chip mounting area at an end of the liquid cooling plate close to the liquid inlet; (3) processing sink holes at upper ends of the liquid outlet and the liquid inlet, thus completing fabrication of the liquid cooling plate; (4) electroplating the liquid cooling plate after cleaning and drying thereof to prevent corrosion; and (5) soldering a positive electrode of a chip onto a heat sink with a hard solder using a die bonding process; then soldering together the heat sink, the chip and an insulating plate with a micro liquid cooling plate and a copper connection plate using a reflow soldering process; or connecting the chip with the liquid cooling plate with a soft solder in case there is no step in the chip mounting area of the liquid cooling plate.