| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition preventing a resist shape from being shaped into an overhung or undercut shape and having superior laminate temperature likelihood and plating resistance, and to provide a dry-film type alkali-developable photosensitive film and a photosensitive permanent resist that use the photosensitive resin composition. <P>SOLUTION: The photosensitive resin composition contains (a) an acid-modified vinyl group-containing epoxy resin; (b) a photopolymerizable monomer having at least one ethylenically unsaturated group in the molecule; (c) an acyl phosphine oxide compound; (d) a guanamine derivative; and (e) dicyandiamide. <P>COPYRIGHT: (C)2011,JPO&INPIT |
