发明名称 SOLDER ALLOY FOR ACOUSTIC DEVICE
摘要 <p>To provide audio solder alloy which is senary solder alloy (of Sn€¢Ag€¢Cu€¢Sb€¢In€¢Ni€¢Pb) and has their appropriate contained amounts to obtain excellent sound quality and high auditory assessment, as the joining solder for connecting various kinds of electronics parts used for electronic circuit such as a filter circuit NW for audio system. A preferably example of the contained amounts is as follows: Ag of (1.0 through 1.01 % by mass), Cu of (0.71 through 0.72 % by mass), In of (0.003 through 0.0037 % by mass), Ni of (0.016 through 0.017 % by mass), Pb of (0.0025 through 0.0035 % by mass) and the remainder of Sn.</p>
申请公布号 EP2644313(A4) 申请公布日期 2014.07.23
申请号 EP20120858684 申请日期 2012.05.10
申请人 SENJU METAL INDUSTRY CO., LTD. 发明人 AKAGI, IPPEI;TOKIMOTO, HIDEKI;SUZUKI, SEIKI;SEINO, MASAHUMI;OSAWA, ISAMU;UESHIMA, MINORU
分类号 B23K35/26;C22C13/00 主分类号 B23K35/26
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