| 摘要 |
The present invention relates to a polishing head of a CMP apparatus including a high strength alloy, which prolongs lifetime of a product by preventing crack generation of a ceramic material by improving a structure of a circular perforated plate constituting the polishing head and replacing the material with a high strength special alloy, and at the same time improves production efficiency by maximizing operation rate of an equipment. A polishing head of a CMP apparatus includes a pressure control device (11), an absorption part (12), a circular perforated plate (100) and a retainer ring (13). The perforated plate (100) includes: a circulate plate type body (110); a pair of alignment grooves (111, 111) formed symmetrically to both sides in the upper center of the body (110); a number of holes (112) formed in the body (110); four perforated holes (113) formed at one side of the body (110); a center groove part (114) formed in a rear center of the body (110); a ball (115) having a part be inserted into the center of the center groove part (114); a circular metal plate (116) which is inserted, fixed and installed in the center of the center groove part (114), and has an exposure hole (116a) formed to expose a part of the ball (115); a plurality of balance pins (117) inserted and fixed around the center groove part (114); and an upper and a lower border part (120, 130) for fixing and surrounding a border of the body (110). The metal plate (116) is constituted with a special alloy including zirconium, titanium, nickel and chrome. |
