| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component having a lower surface electrode structure, in particular the one allowing solder joint to be easily confirmed. SOLUTION: The electronic component 100 has electrodes 200 and 210 for connection to the terminal of an element on the lower surface of a package. It includes through-holes 300 and 310 that penetrate the package vertically. The entire or a part of an opening part at the lower part of each through-hole is arranged in the region occupied by the electrodes 200 and 210 and is formed by penetrating the electrode 200 and 210. COPYRIGHT: (C)2010,JPO&INPIT |
