发明名称 |
FLIP-CHIP COMPONENT PACKAGING PROCESS |
摘要 |
A flip-chip package comprises a substrate having at least one layer and a component flip-chip mounted to the substrate, the component having a field termination ring. The flip-chip package further comprises a shield plane interposed between the at least one layer of substrate and the field termination ring. |
申请公布号 |
EP1599902(B1) |
申请公布日期 |
2014.07.23 |
申请号 |
EP20040710614 |
申请日期 |
2004.02.12 |
申请人 |
MEDTRONIC, INC. |
发明人 |
BOONE, MARK, R.;FENNER, ANDREAS, A.;MILLA, JUAN, G.;LARSON, LARY, R. |
分类号 |
H01L23/552;H01L21/56;H01L23/48;H01L23/58;H01L29/06 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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