发明名称 |
Photocurable moisture-proof insulating coating material for mounting circuit boards |
摘要 |
<p>The present invention provides a photocurable moistureproof insulating coating material for mounting circuit boards, comprising a curable composition comprising:
(component A) a compound having a structural unit derived from a dimerdiol and having, as an end group, a group represented by formula (1):
wherein R 1 represents H or CH 3 and R 2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end of the compound;
(component B) a non-silicon-containing monofunctional (meth)acryloyl group-containing compound; and
(component C) a photopolymerization initiator.</p> |
申请公布号 |
EP2757122(A2) |
申请公布日期 |
2014.07.23 |
申请号 |
EP20140001379 |
申请日期 |
2010.12.06 |
申请人 |
SHOWA DENKO K.K. |
发明人 |
OOGA, KAZUHIKO;AZUMA, RITSUKO |
分类号 |
C08G18/81;C08F290/06;C08G18/83;C09D5/25;C09D175/16;H05K3/28 |
主分类号 |
C08G18/81 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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