| 摘要 |
<p>The invention provides a resin composition having a low dielectric tangent with respect to a cured article and having excellent adhesion strength to a conductor after the environment acceleration test. The invention provides a resin composition, characterized by comprising (A) an epoxy resin, (B) a cyanate ester resin, (C) an active ester curing agent and (D) a curing enhancer.</p> |
